According to the news released by Qingdao, it was learned from the Qingdao Development and Reform Commission that on January 10, the 2022 Qingdao municipal key projects were officially released and implemented with the consent of the Qingdao Municipal Government projects include companies like Huawei, BOE, Konka, Royole, Goertek.
This year’s “No. 1 Document” and “Notice on Announcement of the List of Key Projects in Qingdao in 2022” (hereinafter referred to as the “Notice”), Qingdao once again aimed at the “Four New” economy, focusing on the main direction of advanced manufacturing, planning ahead, earnestly demonstrating.
After careful screening, according to the idea of ”focusing on key projects and focusing on key projects”, the Qingdao Municipal Government has researched and determined that in 2022, the city will arrange 416 key projects in the city with a total investment of 928.21 billion yuan, including 300 key construction projects with a total investment of 639.56 billion yuan; There are 116 key preparation projects with a total investment of 288.65 billion yuan.
Moreover, the “Notice” shows that among the 416 projects, there are 238 “four new” economic projects, with a total investment of 415.506 billion yuan, and the number and investment proportion are 57.2% and 44.8% respectively. From the perspective of industrial fields, the top three industrial fields are the high-end equipment industry, new-generation information technology industry, new energy, and new material industry, with 67, 34, and 32 respectively, accounting for 44.33%.
Among them, key construction projects include Huawei artificial intelligence computing center project, Qingdao Microelectronics Industrial Park and intelligent microsystem module industrialization project, BOE IoT mobile display port device production base project, CIS photosensitive chip packaging, and camera module manufacturing projects, etc.; Key preparation projects include Royole’s sixth-generation fully flexible color AMOLED display production line project, Huaxin Jingyuan’s third-generation semiconductor compound wafer substrate project, and Qingdao Fusion New Material Technology Co., Ltd. Mini LED backplane project.