Intel’s next-generation Xeon Sapphire Rapids-SP processor has not yet been released. It will use the Intel 7 10nm process and use the Golden Cove architecture. According to the VideoCardz, a German overclocker, Der8auer, managed to buy a processor. After getting it, he opened the cover and further removed the chip to observe the structure.
Moreover, the revealer used a heating station to heat up the processor in order to melt the brazing metal inside. After opening the cover, you can see that the four huge chips inside are compactly arranged together.
Furthermore, the name of this processor is ” Xeon vPRO XCC QWP3 “, and the specific parameters are currently unknown. Der8auer heats the processor again and tries to peel off a single chipset.
As can be seen from the photo, a single chip has 16 cores and four total 64 cores. But Intel has limited this generation of processors, so the maximum number of cores available is 56.
The revealer peeled off the chip by heating the CPU. At this time, the substrate was severely damaged and had serious burn marks. Zooming in on the chiplet, you can see the dense solder joints on the back. The distance between each pad is a minimum of 0.053mm and a maximum of 0.099mm.
Besides, Intel Sapphire Rapid-SP series processors are launched for HEDT high-performance computers, and Sapphire Rapids-X series processors are expected to be released in 2022.